4G

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  • Compact and reliable design to achieve cost effective.
  • Ease-of-use interfaces for operation.
  • Vision-assist system for precisely wafer-align and position recognition.
  • Selectable platform for 2 various tools in efficient operation.
  • Non-stop online needles cleaning design.
  • High throughput prober in various field of applications.
  • Up to 200mm probing area.

3GS

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  • Wafer / Chip prober
  • Dark box design.
  • Compact, rigid and reliable semi-auto chip probing system.
  • Easily set-up and operate.
  • Particularly well suited for various chip-type products.
  • Industrial PC control base, software with high flexibility.
  • Customer oriented service policy, accept individual customer.
  • Up to 150mm probing area.

Molding Equipment

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  • Available for Lens product & CSP phosphor film.
  • High performance with low cost.
  • User friendly program.

Dispensing Product

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  • Total solution for LED products, COB, SMD, EMC and CSP.
  • Applied for semiconductor field, solder paste, ACP glue, under-fill and adhesive usage.
  • High accuracy and performance with good quality and yield rate.
  • Convenience for switching with all valves.

CPS-A1300 Fully-Auto

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  • Discrete COB test station.
  • Tube-in/ Tube-out.
  • 6 work stations.
  • Φ500mm sphere is practicable.
  • Dark box is practicable.

CPA-100 Fully-Auto

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  • Array COB pre-test station.
  • Up to 190 x190mm.
  • Dim-test is practicable.
  • φ500mm sphere is practicable.
  • Dark box is practicable

AP-100 Semi-Auto

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  • Array COB pre-test station.
  • Up to 170 x180mm.
  • Dim-test is practicable.
  • φ500mm sphere is practicable.

CSP P-S-T Solution

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  • Ready and mature solution.
  • Unified DFT 2-6-1/ 2-8-1 frame loader from probing to taping.
  • High system utilization between 3 stations.
  • High flexibility to perform specific job function by any single station.
  • Low conversion cost.

Laser System

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System Features
    • Dual or Multi-Wavelength Systems.
    • Independent or Dual Attenuation.
    • Fixed or Adjustable Polarization.
    • Beam Bending.
    • VMU.
Applications
    • Ablation, LIBS, PIV, Cell Repair.
    • Mass Spectrometry and TFT-LCD Panel Repair.