Batch Wafer ID Reader

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  • For 8 inch wafer only.
  • Compact footprint for tabletop use.
  • Alignment & ID reading of various wafer types.
  • Fast cycle times (35 sec / 25 slot).
  • User friendly SEMI standard GUI.
  • CE certified.
  • SEMI standard compliant.
  • No additional Hardware require.

Wafer ID Reader

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  • Support to decode OCR, Barcode, Data Matrix and QR-code
  • Revolutionary integrated RGB illumination
  • Intelligent recipe handling
  • Fully automatic exposure control
  • Wider FOV 35mm x 13mm
  • Code shift compensation, Flexible ROI
  • Additional external RGB illumination

Warpage Adjustment Tool

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  • Fully auto warpage adjust of wafers up to 300mm.
  • Warpage inspection and auto readjust function available.
  • Can be configured for up to 4 FOUP load ports.
  • Wafer ID reading and SECS/GEM comm.
  • Warpage wafer handling ability: up to 7mm.

Automatic Debonder Machine

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  • Automaic 330/300/200mm eWLB debonding tool.
  • Safe separation of eWLB substrate from its carrier.
  • Throughput-enhancing preparation chamber.
  • Temperature range : +20℃ up to +240℃.
  • Warpage wafer handling ability: up to 7mm.
  • Typical post-warpage adjustment result : up to 500um.

Thermal Air TA-5000

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  • 50 / 60Hz same system. 
  • Features:
    • Continuous Air Flow up to 18 SCFM @-80C/+225C
    • -55C to +125C/ +125C to -55C less than 10sec
    • Ultra Stable DC Temperature Control
    • Frost Free Operation/ Built-in Air Dryer
    • No LN2 or CO2 Required
  • Application fields:
    • Device temperature characterization on components,
    • hybrids, modules, PCBs, and other electronic and
    • non-electronic assemblies at precise temperature sensing
    • from - 80°C to + 225°C

LEDA T200

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  • Fiber-less.
  • Position Sensor for Filters.
  • Adjustable Test Items.
  • One Step Test for VF , LOP & WLD.
  • Compensate for Multi-Optical.
  • Calibration.

LEDA A2000P

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A2000P is fully auto LED chip inspection system, including:
  • High resolution optical system.
  • Muture analysis logical.
  • Muture and Steady hardware.
To verify the defect upon LED chips.

LEDA M76FP

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  • Quickly change bin design.
  • Max 125 bin grade.
  • Single transfer system to load/unload.
  • Auto nozzle clean module(option).
  • Up to 4” wafer sorting with 8” ring.

Probe Needles

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  • For Probing
  • Provide with below materials:
    • Beryllium-Copper
    • Heat-treat Beryllium-Copper
    • Paliney Alloy series
    • H3C Alloy
    • Tungsten
    • Accept customize spec, including the tip angle, tip radius, or the tip length