Standalone, automatic, single-wafer transfer and wafer mover. 300mm Wafer Sorter with the mapping end effector. An automated, stand-alone transfer tool. The cost-effective tool to reduce wafer breakage and scratches caused by manual wafer handling. This simple sorter is compatible with all SEMI compliant FOUP, FOSB, and metal cassettes. Wafers are gently lifted from cassette slots before being extracted or loaded. This reduces contact with the cassette, minimizing particle generation and wafer edge chipping. Designed for ISO Class 5 (FS209E Class 10).

 

WS300 Features:

• Touchscreen control
• 350 wafers per hour
• Gravity End Effector with peek pads and snubber.
• Wafer mapping checks for wafer presence, cross-slot, double stack
• Combining wafers into one cassette *Multiple Recipe Modes
• Antistatic construction

 

Specification:

Wafer Size	300mm
Power Requirements	24VDC 2.7A, 100-240VAC to 24VDC Power Supply Sold separately
Throughput	350 wafers per hour
Weight	350 lbs

A stand-alone tabletop automation system features two-cassette stage configuration. A cost-effective automation tool designed to reduce wafer breakage and scratches. Compatible with industry standard shipping, process, and metal cassettes. Provides a highly flexible control system that any operator can use with minimal training.

The tool is operated from a touch screen display.  Operators load the cassettes onto the stage.  To move wafers between cassettes, the operator can choose one of the three available modes:

• Manual Mode
• Quick Transfer Mode
• Recipe Mode

A safe vacuum-less low-contact end-effector includes a wafer mapping sensor that maps wafer locations in each cassette and detects wafer presence for accurate movements.

Options:

• SECS/GEM Tool Interface
• Integrated OCR Automated
• Pre-Aligner

Features:

• Single wafer transfer
• Lot split transfer
• Merge applications
• Pitch change applications
• "Fill" loading/removing test wafers from a parent lot
• Scratch reduction by eliminating manual wafer handling
• Combining wafer lots/splitting lots/odd-even
• Thin wafer handling (up to 2mm warpage)
• MEMS or Taiko® (wafer edge end-effector option)

 

Specification:

Wafer Size	100mm- 200mm
Power Requirements	24VDC 3 Amps 120VAC to 24VDC Power Supply Specify when order

Tabletop, automatic FOUP to FOSB wafer transfer tool. Wafers are mapped, then gently bulk-lifted in the cassette; minimizing contact with the cassette and eliminating the chances of particulation, abrasion, or wafer edge chipping. The sturdy construction assures high reliability, low maintenance, small footprint saves valuable cleanroom space. Antistatic construction; Specify cassette model number(s) with order. Designed for ISO Class 3

 

The LCT1AS12 Features:

• Touchscreen control
• FOUP to FOSB
• Mapping feature checks for cross slot, double stack and wafer presence
• PVDF coated rods transfer 25 wafers at a time

 

Specification:

Wafer Size	300
Power Requirements	24VDC 3 Amps 120VAC to 24VDC Power Supply Sold seperately
Throughput	60 cassettes per hour
Weight	75 lbs

Tabletop, automatic high-value, thin wafer, compound wafer transfer tool. Wafers are gently bulk-lifted midpoint in the cassette slots before being extracted or loaded. This is to minimize contact with the cassette, eliminating chances of particulation or wafer edge chipping. High reliability and low maintenance. Small footprint saves valuable cleanroom space. Designed for ISO Class 3 (FS209E Class 1); Antistatic construction; Specify cassette model number(s) with order.

 

The LCT2 Features: 

• Touchscreen control
• PVDF coated rods transfer 25 wafers at one time
• Door present detection
• Wafer detection in cassette and in tool

 

Specification:

Wafer Size	76, 100, 150, 200
Power Requirements	24VDC 3 Amps 120VAC to 24VDC Power Supply Sold seperately
Dimensions	10"W 30"L 16"H
Weight	40 lbs

Tabletop, automatic two-cassette vertical bulk-wafer transfer tool. Transfers wafers between various combinations of plastic, metal and quartz cassettes. Cassettes move, rather than wafers, for safer, cleaner transfers. Single-button operation makes the tool user-friendly. The AVT is a high reliability, low maintenance system. Designed for ISO Class 3 (FS209E Class 1); Antistatic construction; Specify cassette model number(s) with order.

 

Wafer Contact Materials: Antistatic Polypropylene & Acetal, which are high purity materials with good wear resistance, good thermal properties, and outstanding chemical resistance.

 

The AVT Features:

• Transfers 25 wafers at one time.
• 30 second cycle-time.
• Lift comb is made from ESD-safe Acetal material.
• Retainer combs are made from Black Acetal.

 

Specification:

Wafer Size	76, 100, 150, 200
Power Requirements	24VDC 3 Amps 120VAC to 24VDC Power Supply Sold separately
Throughput	60 cassettes per hour
Weight	40 lbs

Tabletop,automated bulk-wafer transfer tool. Wafers are horizontally “slide-transferred” between two cassettes. Most are compatible with high profile and low profile cassettes. The wafer transfer (AHWT) series is a very low maintenance product. Current sensing to reverse direction if resistance is felt. Designed for ISO Class 5 (FS209E Class 10); Antistatic construction, chemical resistant; Specify cassette model number(s) with order.

 

Specification:

Wafer Size	76, 100, 150, 200
Power Requirements	12VDC 3 Amps 120VAC to 24VDC Power Supply Sold seperately
Throughput	100 cassettes per hour
Weight	35 lbs