Automatic Debonder Machine

  • Automaic 330/300/200mm eWLB debonding tool.
  • Safe separation of eWLB substrate from its carrier.
  • Throughput-enhancing preparation chamber.
  • Temperature range : +20℃ up to +240℃.
  • Warpage wafer handling ability: up to 7mm.
  • Typical post-warpage adjustment result : up to 500um.