Bulk, Automatic Horizontal Wafer Transfer – LCT1AS12
Tabletop, automatic FOUP to FOSB wafer transfer tool. Wafers are mapped, then gently bulk-lifted in the cassette; minimizing contact with the cassette and eliminating the chances of particulation, abrasion, or wafer edge chipping. The sturdy construction assures high reliability, low maintenance, small footprint saves valuable cleanroom space. Antistatic construction; Specify cassette model number(s) with order. Designed for ISO Class 3
The LCT1AS12 Features:
- Touchscreen control
- FOUP to FOSB
- Mapping feature checks for cross slot, double stack and wafer presence
- PVDF coated rods transfer 25 wafers at a time
Specification:
| Wafer Size | 300 |
|---|---|
| Power Requirements | 24VDC 3 Amps 120VAC to 24VDC Power Supply Sold seperately |
| Throughput | 60 cassettes per hour |
| Weight | 75 lbs |