X-ray Inspection System – Quadra7

X-ray Inspection System – Quadra7
  • Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
  • The X-ray inspection and failure analysis tool of choice in a wide range of industries, including electronics packaging and wafer level manufacturing, automotive, energy and aerospace electronics inspection, and medical device and LED fabrication.
  • At the cutting edge of X-ray inspection performance, Quadra 7 shows you features and defects as small as 0.1µm, non destructively.
  • Quickly and easily using X-Plane, and find hard to see defects such as interfacial voids faster.